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TPS54561 Heat Dissipation

Other Parts Discussed in Thread: TPS54561

Hi

I want to use TPS54561,  I bought eval board and it was fine. Than  I maked a test board but i get to much temperature, it was two layer pcb and than made another, than get gerber over wabenc and test with it (difference is it one layer), still have same problem. 

All used same components with demoboard,  VIN = 48 and 12V, Output 5V 2A. I got to much heat more than 500mA output.

What am i missing. Only differcence is being multilayer than eval board.

Ferhat

  • If you post your PCB layout, we can take a look at it.
  • This one 2 layers. Heat problem.

    This one one layer, i prepared pcb in office with old tecniques (with asid, blank pcb and plain sheet). I also soldered a blank pcb to bottom side like ground layer, worked properly exept heat problem. I also make another design from webench like this way. I try to understand if problem occurs about component pacement.

    Finally i did 6 layer pcb, including copy of demoboard, with two tps54561 and one 54561. But didnt send production yet. I have to use the shape. Because i have that place in my device for stepdown.

  • TPS54561 uses an exposed thermal pad to dissipate heat to PCB copper ground area.  In your first two designs you did not provide for it.  I think your 6 layer design looks ok.  It is always best to follow the known good layout of the EVM as close as possible.