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TPS61256 YFF package application note ?

Pial
Expert 7280 points
Other Parts Discussed in Thread: TPS61256

Dear team,

Do we have a document/application note, similar to sbva017, which would provide the design information for 250um bump like for the TPS61256 ?

The following topic brings an answer, but I would prefer if we could provide an app note..:

Thanks a lot for your help !

Best regards,

PA

  • 0
    TI__Mastermind 46905 points
    here is the application engineer of TPS61256YFF. sorry but I didn't find a application note special for the 250um bump PCB guideline. i'll check with the package team if they have similar material and will come to you if i get something new.

    thanks
    Jasper Li
  • 0
    TI__Intellectual 1305 points

    Hi PA,

    Sorry, we don't have a general app note of TPS61256 about all the information in summary, though you can get PCB layout guide, package dimension and so on in datasheet and user's guide.

    BR

    Gene

  • 0 in reply to Jasper Li
    TI__Expert 7280 points
    Dear Jasper,

    Thank you for your answer !
    My customer would appreciate some more information.

    FYI, PCB layout is not a problem, the question is to know which solder mask opening to use:
    - using a 300um opening as recommended in the document I found (see the link in my previous post) only left ~100um between two pads in a 400um pitch package. Doesn't it increase the risk of short circuit ?


    Thanks again !
    Best regards,
    PA
  • 0 in reply to Pial
    TI__Mastermind 46905 points

    please refer this application note www.ti.com/lit/snva009

    our EVMs are build based on this AN. About the risk, i think it also relate to the PCB and assembling manufacturer. the customer may need to discuss with their manufacturer if it is OK. 

    thanks

    Jasper Li