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Alternatives to LMZ10505 with Same Package, but Higher Reflow Temp Limit

James Evans
Mastermind 49692 points
Other Parts Discussed in Thread: LMZ10505, LMZ30602, LMZ30604

Hi!

I am using the LMZ10505 part, but I am experiencing several failures after solder reflowing.

Due to some ROHS FPGA's, the reflow temperatures for the board reaches approximately 260C. Unfortunately, the maximum reflow temperatutre for the LMZ10505 is 245C, which is why some fail afterwards.

Does anyone have a recommended replacement part with the same (or similar) package but higher (ideally > 260C) reflow temp limit?

The power rails are:

  • Vin: 5 to 5.5V
  • Vout: 3.3, 2.5, 1.8 and 1.0V
  • Iout: 1, 3 and 4A depending on the design.       

Thanks,

James

  • 0
    TI__Genius 16025 points

    James,

    I don't think we have any part that can meet your needs exactly (package variations, that is). Perhaps the LMZ3 can fit your application. LMZ30602, LMZ30604.

    www.ti.com/.../qfn-package-modules.html

    Thanks,
    Anston

  • 0 in reply to Anston Lobo
    TI__Mastermind 49692 points
    Hi Anston,

    Thank you for your quick response!

    I was actually just looking at the LMZ3 parts but could not find any reflow temp information.

    Do you know where I can find that information?

    James
  • 0 in reply to James Evans
    TI__Mastermind 49692 points

    Also, I checked out the Soldering Requirements for BQFN Packages App Note, and I found the following:

    3 Surface-Mount Soldering Qualification ( pg. 2)

    BQFN devices are qualified to have no degradation from reflow/IR soldering and aqueous washing by

    verification through rigorous testing. Sample batches are subjected to three passes through a convection

    reflow oven and an aqueous wash cleaner, with a cool-down between passes to room temperature. The

    convection reflow oven is set to achieve 245°C to 260°C peak temperature on any pin or component.

    These parts are subsequently used for thermal shock, humidity, and life qualification testing. All products

    must pass this initial qualification testing with zero failures before being released to production.

    However, the max reflow temp of these parts seems to be lower in the Sample Reflow profile.

    Can this part handle 260C for some time?

    Thanks again for your help here.

    James

  • 0 in reply to James Evans
    TI__Genius 16025 points
    If you look towards the end of the datasheet, there is a section called Package addendum option. It states the Packaging information for the part and the thresholds for reflow and operation. For the LMZ30604, it is page 22.

    In this case. The option is MSL3 (moisture sensitivity level) and the temperature is 260C.

    Thanks,
    Anston
  • 0 in reply to Anston Lobo
    TI__Mastermind 49692 points
    I did not notice that! Thanks for pointing this out.

    This is very helpful.

    Regards,

    James