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TPS560200DBV and TPS563209DDC heat transfer

Jan Bijwaard
Prodigy 10 points
Other Parts Discussed in Thread: TPS560200, TPS563209

TPS560200DBV and TPS563209DDC
We have some questions about the heat transfer away from both regulators.

In the layout guidelines of the TPS560200DBV datasheet suggest the package has a exposed thermal pad.
The land pattern data does not give information about the exposed thermal pad
The Junction-to-case (bottom) thermal resistance is low for a SOT package.
Is a exposed thermal area/pad present?

The TPS560200DBV layout guidelines uses 3 via's under the package.
The TPS563209DDC generate more heat.
Are the 4 via's outside the package on the SW pin (see layout guidelines)
enough to transfer heat away from the TPS563209DDC?

  • 0
    TI__Guru**** 191445 points

    There is no exposed thermal pad for those devices. The TPS560200 does rout some GND under the IC and those vias are used to connect the top side GND to the bottom side GND plane.  You may get some heat transfer benefit from that, primarily form the GND pin connection.

    The same hold true for TPS563209.  There are 2 vias directly adjacent to the GND pin that ties the top side GND to the bottom layer GND plane.  The vias on the SW node provide a different function.  For best operation it is very desirable to connect the input capacitors directly across the VIN and GND pins which straddle SW.  To accommodate this, the SW node copper trace is passed to the bottom side, routed under the GND connection to the IC, then returned to the top side to connect to the output inductor.