I am developing a USB charging product and was hoping to use the TPS2511 to interface with USB products, however I do not have the prototyping facilities to solder an underside pad as the PowerPAD is on this chip. To my understanding, this is only for thermal conduction, however, and I was hoping someone could confirm this for me please? If so, would I be OK to operate without the solder and maybe with thermal paste instead?
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