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TPS7A4501-SP LDO Vreg Thermal Interface

Craig Turner
Prodigy 50 points

The datasheet shows in Figure 29 the typical HKU package with formed leads at .004-.022" gap between bottom of leads and body. Why the large gap? If it's going to be soldered for the best thermal performance, shouldn't the gap be smaller? Is it preferred to use a thermal compound rather than solder?

Thanks

  • 0
    TI__Intellectual 1130 points
    You've hit on one of the main reasons these packages are sold unformed. Most customers I've talked to use thermal epoxy to insure 100% coverage, and because not all packages on the board have thermal pads. Even at that the stand off height varies depending on whether the are using film or dispensed epoxy. Some, though, like you, want to solder so need a much lower standoff.
  • 0 in reply to R.A. Pauley
    Prodigy 40 points
    Hi,
    Some questions
    1) if the metal lid and metal heatsink pad on the body of the TPS7A4501 are electrically isolated.
    2) Is reflow soldering of the TPS7A401 recommended? The reflow profile would be SN63. Couldn't find any mention of peak body temperature.

    Thanks in advance.