recently my customer seems have humidity problem in TPS40055 application. so they need TI to provide this spec. to them to identify internal specification. So please help to advice.
They also mentioned can TPS40055 be exposed to occasionally 80% + relative humidity conditions.
Do they really need protective coating for IC? Is there a good protective coating for PCBs that you could recommend that would protect against this presumable humidity issue?
They use hot melt glue to cover IC pin and package then the humidity test is pass. But if they only cover IC pin then the test is still fail. So can you advice what possible reason for this different testing condition? Does water flow into IC via package?
Thanks