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Reg Lp3850x-ADJ

Sureshbabu Sundaram
Prodigy 10 points

Hi,

I got two questions regarding this LDO

1. In the datasheet, the junction to ambient thermal resistance for KTT(DDPAK/TO-263) and NDQ(T0-263) are given as 41.8 C/W and 33.3 C/W respectively. According to datasheet the NDQ package has lesser junction to ambient thermal resistance compare to the KTT package but the package dimension of DDPAK is bigger than NDQ package. Is the number in datasheet for junction to ambient thermal resistance is valid?

2. Can I parallel this LDO to share the load?


Thanks

  • 0
    TI__Mastermind 22610 points

    LP3850xTJ (NDQ / TO-263 Thin) Theta JA-High K = 33.3  C/W

    LP3850xTS (KTT / DDPAK/TO-263) Theta JA-High K = 41.8 C/W

    Yes, the datasheet values are valid.

    I believe that the material used in the lead-frame, and the reduced package thickness, accounts for the across-the-board better thermal performance of the NDQ package.

    As for operating with multiple LDO outputs connected to one load, generally not an efficient method of operation, but possible.

    See:

    SLVA250 - Ballast Resistors Allow Load Sharing Between Two Parallel DC/DC Converters