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BQ24610 grounding question

Shang Wu18
Intellectual 270 points

Hi,

How should we connect the thermal pad and the ground pin (#17) for BQ24610RGER in a star ground system? We have 2 ground planes, one analog one noisy digital. From what I have read is to connect both the ground pin (#17) and the thermal pad right at the chip and use a lot of vias to connect to AGND plane immediately at the chip. There’s a different opinion that suggests separating the ground pin (#17) and the thermal pad and connect them at other place (single point GND) where all other grounds meet. This common ground point may be few inches away or even on the other board.

Like most switching regulators, the first option seems to make more sense, but just need the clarification to ensure the quietness of the system.

Thanks.

  • 0
    Prodigy 90 points

    Don't hold your breath if your waiting for a TI engineer. I'd suggest cap filter to attenuate the noise to ground. If that doesn't work, you can wait for ti to give a better answer . And I stress wait..... Till batteries are obsolete, and were using warp drives and zero point energy.  (edit) okay maybe not wait too long... Like Smriti B said "Please follow rule #7 from the layout guides in the datasheet on page 32. You can follow the EVM layout as an example where you can see the GND pin and the thermal pad are tied to two different ground symbols, and then connected together at a single point."

  • 0
    TI__Expert 5565 points

    Shang,

    Please follow rule #7 from the layout guides in the datasheet on page 32. You can follow the EVM layout as an example where you can see the GND pin and the thermal pad are tied to two different ground symbols (in the EVM schematic), and then connected together at a single point.