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TLV71333P Power Dissipation(Thermal information)

Other Parts Discussed in Thread: TLV713

Hi

Customer is searching compact LDO.
I would like to recommend TLV71333P.
He is worrying about heat.
He is using 12mm*10mm board.

Could you give me thermal data as the following picture, please?
Customer condition is Vin=5V, Vout=3.3, Iout=0.003A

Best regards,
Shimizu

  • Hi Shimizu-san,

    Given PD = (VOUT - VIN) IOUT, your PD is 5.1 mW, assuming an ambient temperature of 85°C TLV713 meets the thermal requirements (thermals would be even better at lower ambient temperatures).

    Additionally you can estimate the Junction Temperature (TJ) based on your experimental temperature readings. I am assuming your measured the temperature on top of the IC.

    Using the following equation we can estimate TJ:

    ΨJT : TJ = TT + ΨJT * PD      

    Where:
    - ΨJT is a thermal metric provided in the datasheet for estimating TJ.
    - TT is the temperature at the center-top of the device package.
    - PD is the power dissipated by your device.

    TJ = 49.9°C + ΨJT * 5.1 mW, so in the worst case scenario for this device your TJ is 50.15°C, which within the operating conditions for TJ (-40°C to 125°C). Your PD is so relatively small that TT will be approximately equal to the TJ, all your costumer has to make sure is that TJ is within the operating range (-40°C to 125°C).

    References:
    - Semiconductor and IC Package Thermal Metrics application report, SPRA953

    Regards,
    Victor