Thermal caracteristics of TPS563209 and TPS54327

takahiko yokota

Mastermind 7135 points

Other Parts Discussed in Thread: TPS563209, TPS54327

Hello

The results were attached document I simulated thermal characteristics of TPS563209 and TPS54327 by WEBENCH.
Pd of TPS563209 grows big with a rise in temperature, but TPS54327 is uniform regardless of increase temperature.
Is the factor increase Ron?
Can I get figure about Ron vs Temperature of TPS563209 and TPS54327?

Best Regards,
Yokota

over 9 years ago

0 JohnTucker over 9 years ago

TI__Guru**** 191445 points

TPS54327 has an exposed thermal pad. It will have substantially better thermal performance than TPS563209.

0 takahiko yokota over 9 years ago in reply to JohnTucker

Mastermind 7135 points

Hello John-san

Simulation results were attached document.

The Tj grows big both TPS563209 and TPS54327.

I think thermal characteristic of Ron have relevance not changing Pd.

Does this not matter?

Thermal.pdf

Best regard,

Yokota

0 JohnTucker over 9 years ago in reply to takahiko yokota

TI__Guru**** 191445 points

I think this needs to be moved to the webench forum.

0 JohnTucker over 9 years ago in reply to JohnTucker

TI__Guru**** 191445 points

Another thought. RDSon does increase with temperature, so you may be seeing a multiplying effect. Since TPS563209 does not have a thermal pad, it heats up quicker and RDSon and PD increase more relative to TPS54327.

Power management

Power management forum

Thermal caracteristics of TPS563209 and TPS54327