We are planning to use the LMZ14203 simple switcher and we would optimize PCB thermal performance specifying exactly the required power dissipation pad, also as a function of copper thicknesses that differ from 1oz..
Related to the datasheet we have: "With no airflow and no external heat, a good estimate of the required board area covered by 1 oz. copper on both the top and bottom metal layers is: Board Area_cm^2 >500°C×cm2/W/RθCA". This is a good starting point if we have a 35um (1oz) but what if we have 17.5um (1/2oz), do we need to set it to 1000 instead of the 500? Could be possible to have a kind of correction factor as a function of copper thickness.
