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TPS2384 Heatsinking

Jay Perrin
Prodigy 40 points
Other Parts Discussed in Thread: TPS2384

I'm using the TPS2384PAP in a design. With a 48V supply and the 4 channels loaded with about 13.5W each, the case (top center) temperature is about 58 deg. C, which is about 20 deg C higher than the TPS2384 on the HPA109 eval board under the same conditions. The voltage drop between the "Nx" pins and "RET" pins are the same between the 2 boards. I can't see any reason why my design would dissipate more power, so I am left to believe it's the pcb heatsinking. What is the copper thickness of the HPA109 REV. B board? My board is 6 layers. thermal vias under the PowerPad connect the top layer to 2 internal ground layers and the bottom layer. See picture. Should my top layer be at 2 oz. copper? Any ideas why the TPS2384 on my board is running hotter?

  • 0
    TI__Genius 15685 points

    Hi Jay,

    Since this board was designed ten years ago, I am checking with the designer for the copper thickness and I will get you the information ASAP.

    The copper thickness does have some influence but I don't think it would have that huge impact. Can you check those things below:

    1. Check the solder between IC and the heat sink pad is good enough.

    2. Run your board and the TPS2384EVM under same condition and compare the  input power to see if there are any differences.

    Best regards,

    Penny

  • 0 in reply to Penny Xu
    TI__Genius 15685 points

    Hi Jay,

    Since this board was designed many years back and I don't have access to the software package to open the design files. we finally found someone to open that database. The design calls for 2oz copper. Hope that helps.

    Best regards,

    Penny