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bq51003

gianluca peterle
Intellectual 475 points
Other Parts Discussed in Thread: BQ51003

Good morning, I asked to a manufacturing company, to produce PCB for BQ51003, quite similar to PCB Board of TIDA-00329, WITH HOLES BELOW IC contacts, but they asked me, to increase holes to 0.2mm, is it possible or could be any problem with the solder?

Thank.

Gianluca

  • 0
    TI__Genius 12485 points

    Hi Gianluca,

    Going off by my experience here working on BGA PCB pads, a 10mil(0.254mm) via with a 6mil(0.152) hole is common. If you increasing the hole size to 0.2mm what about the plating?

    I would very highly recommend plating shut the holes with epoxy as well. (via-fill)

    Regards,
    Gautham Ramachandran
    Apps. Engineer- Energy Management and Transfer.

  • 0 in reply to Gautham
    Intellectual 475 points
    Thank you very much for your answer.
    Gianluca
  • 0 in reply to gianluca peterle
    Intellectual 475 points

    Good morning, just for check, do you mean this kind of platting process? 

    Active Pad

    In the active pad process, vias are plugged with a conductive or non-conductive media, then planarized and plated over.

    This process allows the use of via capture pads as SMT pads. This is advised for via in pad applications only.

    Active Pad

    Pros:

    For active pad vias, this reduces the routing issues on external circuit layers and minimizes inductance.

    Cons:

    During the active pad process, additional process steps are required in addition to a dual plating processes. The extra plating processes have a negative effect on the minimum feature size capable on the external circuit layers. This process is not advised in conjunction with PTFE substrates.