Hello,
I'm trying to understand the best way to route the BQ25120. Given the small pitch for the part, I think via in pad would be a requirement, atleast for the pins in the middle. Since the overall diameter of the pads is quite small (9mils) most PCB houses cannot support a via that would entirely fit the BGA pad.
I'm curious to understand how do people go about this problem. Are they limited to go to select PCB houses that can support such small vias (eg -4mil drill and 8 mil outer diameter) ? Is it possible to have bigger vias which actually extend out of the BGA pads. I'm not sure how that would impact the assembly process of the part.
Does TI have a recommended via size for BQ25120, in terms of via drill and outer diameter?
Any help on this would be great!
Thanks,
Harsh