This chip is on a step-down circuit board very close to TI's reference design and I'm having sporadic failures of the chip (4 failures in approx 30 boards.)
The boards were assembled by a manufacturer I have used with no previous problems. This failure is serious because boards test okay before I ship and customers are finding the problem when things begin to smoke.
It's possible the solder-pad on the under-side of the chip is not bonding reliably to the circuit board. Any suggestions to fix this problem?