TPS63051 DSBGA pad size

Rongfeng Yan

Prodigy 130 points

Other Parts Discussed in Thread: TPS63051

Hi,

The recommended pad diameter for TPS63051 DSBGA is 0.23mm.

May I know 0.3mm diameter is still ok or not?

If so, that means the pad to pad clearance is only 0.1mm (0.4mm pitch - 0.3 pad diameter).

Is this 0.1mm clearance ok for 500mA application? (i.e. DRC check in EDA tool set to 0.1mm clearance)

Since for many PCB factory, the minimum BGA pad diameter capability is 0.3mm.

Thank you.

Regards

Rongfeng

over 9 years ago

0 Lubomir over 9 years ago

TI__Intellectual 2415 points

Hi,

it is ok to use pad diameter 0.3mm.

0.1mm clearance is ok for 500mA. Important is size of the via.

Important is that you check with PCB vendor which size of the pad, clearance and via he is able to produce.

Are you going to use via for the TPS63051?

Best regards

Lubomir Fenic

0 Rongfeng Yan over 9 years ago in reply to Lubomir

Prodigy 130 points

Hi,

I will use 0.254mm trace to connect GND pin out of the bga area and punch a 0.254mm hole size via to inner layer. The via is very close to the GND pad. So there is no via on the bga pad.
Is it ok?

Regards
Rongfeng

0 Lubomir over 9 years ago in reply to Rongfeng Yan

TI__Intellectual 2415 points

Hi,

is should be ok. There should be gap between via's pad and BGA pad called solder resistance.
More information you can find in AN: www.ti.com/.../snoa021c.pdf

Best regards

Lubomir Fenic

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TPS63051 DSBGA pad size