Both the datasheet for this component LMZ34202 and the package detail MPQF400.pdf are missing the details on the thermal pads for this device. Does this exist along with the recommended pads and vias suggested for this component.
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Both the datasheet for this component LMZ34202 and the package detail MPQF400.pdf are missing the details on the thermal pads for this device. Does this exist along with the recommended pads and vias suggested for this component.
Has there been any updates to this original post? I have not seen anything, and would really like to use this part in a new design. With the missing locations and dimensions, this makes it tough to create a correct footprint for this part.
Hi Mark,
We are working to get all of the mechanical drawings included at the end of the datasheet. In the meantime, the required drawings are attached here. Please let me know if something more is needed.