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UC2825 Thermal Information

Star Xu
Genius 9645 points
Other Parts Discussed in Thread: UC2825

Hi

My customer did not find the Thermal Information of UC2825.

Could you provide the information of the RθJA, RθJC(top),RθJB.

Thanks

  • 0
    TI__Genius 9130 points

    Star,

    Which package are you interested in? DIL-16 (J or N designator), SOIC-16 (DW designator) or PLCC-20 (Q or L designator).

    I will check to see if the data is available.

    Thanks,

    Bernard

  • 0 in reply to Bernard Keogh
    TI__Mastermind 25570 points

    Star , Bernard

    I have this data except for the N and Q packages.

    Colin

  • 0 in reply to Colin Gillmor
    TI__Mastermind 25570 points

    Hello

    Here is the thermal data for each of the packages.

    Package Unit
    DW PW N Q FK J
    RθJA Junction-to-ambient thermal resistance 66.4  91.0  48.6  54.8  n/a  n/a  °C/W
    RθJC(top) Junction-to-case (top) thermal resistance 31.6  26.1  35.6  32.8  31.2  34.2  °C/W
    RθJB Junction-to-board thermal resistance 34.1  42.2  29.6  19.0  30.9  48.9  °C/W
    ψJT Junction-to-top characterization parameter 8.6  1.3  16.0  9.0  n/a  n/a  °C/W
    ψJB Junction-to-board thermal resistance 33.7  41.6  29.4  18.7  n/a  n/a  °C/W
    RθJC(bot) Junction-to-ambient thermal resistance n/a  n/a  n/a  n/a  3.3  8.9  °C/W

    Please let us know if you need any further information.

    Regards

    Colin