TPS54561 / Thermal Condition

Kuramochi Tadahiko

Guru 28715 points

Other Parts Discussed in Thread: TPS54561

Hi,

My customer is considering the TPS54561 on following condition.

Could you confirm whether there is problem for thermal?

- Vin : 35~60V

- Vout : 5V

- Iout : 2.0A

- Ta : 60℃

- Board size(whole) : 70mmx106mm

- Board size(this power block) :30mmx50mm

- Layer of the board : 2 layer

- Thickness of copper : 35um

- The case is not sealing. It has slits.

Please let me know if there is lack of information.

Best Regards,

Kuramochi

over 9 years ago

0 JohnTucker over 9 years ago

TI__Guru**** 191445 points

I ran a rough simulation in webench. assuming the bottom side is a full copper GND plane, it looks like the die junction temperature is 123 deg. C. You have some headroom for the 150 C. max junction temperature. but it will depend on what else is on your board. Webench assums that only the TPS54561 components are populated.

0 Kuramochi Tadahiko over 9 years ago in reply to JohnTucker

Guru 28715 points

John-san,

Thank you for your support.

How about die junction when the board is 4-layer?
And is there any good idea or device for fulling above condition?

Best Regards,
Kuramochi

0 JohnTucker over 9 years ago in reply to Kuramochi Tadahiko

TI__Guru**** 191445 points

4 layer 1 oz. shows Tj = 94.6 C. Both internal layers are copper GND planes.

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TPS54561 / Thermal Condition