LP2998 Thermal Information

Takamune Suzuki

Other Parts Discussed in Thread: LP2998

Hello,

Looking at the past discussion on the same topic (see the below link) for LP2998 thermal information, the Junction-to-ambient thermal resistance for each pkg shown on that thread is different fromt that shown in the datasheet.

https://e2e.ti.com/support/power_management/linear_regulators/f/321/t/298066

Why is that?

over 8 years ago

0 Takamune Suzuki over 8 years ago

TI__Intellectual 1000 points

Actually, what I need is the information of the junction-to-case(bottom) thermal resistance.
I can see all the thermal inforamtion icluding the junction-to-case thermal resistance in the past post.
However, as I menitoned, the junction-to-ambient thermal resistances are different from those shown on the datasheet. So, I am suspecting the test conditions may be different.

0 Donald Jones over 8 years ago in reply to Takamune Suzuki

TI__Mastermind 22610 points

Thermal information in the datasheet (Section 7.5 Thermal Information) today appears to be leftover from National Semiconductor, it's not to the present TI standards.

TI Analog Package Group says :

For the LP2998MR (DDA) SO PowerPAD : RΘ(j-c), bottom = 8.4°C/W
For the LP2998MA (D) SOIC : RΘ(j-c), bottom = N/A as there is no thermal pad on the bottom side

0 Takamune Suzuki over 8 years ago in reply to Donald Jones

TI__Intellectual 1000 points

Thank you. I understand.

Power management

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LP2998 Thermal Information