• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 63 subscribers
  • Views 382 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS62130 Ground PAD

Ben Kuo
Expert 7570 points

Dear Sir,

I have a question about ground pad.

If the board and IC ground pad don't contact very well. Is it will cause any risk?(like thermal, Vout accuracy)

Thanks for your help!

-Ben

  • 0
    TI__Intellectual 2415 points

    Hi Ben,

    yes there are risks:

    • higher thermal resistance of the package (caused by not appropriate contact of the exposed thermal pad)
    • lower mechanical reliability

    Description from datasheet, page 4: Exposed Thermal Pad: Must be connected to AGND (pin 6), PGND (pin 15,16) and common ground plane. See the Layout Example. Must be soldered to achieve appropriate power dissipation and mechanical reliability.

    Best regards

     

    Lubomir Fenic