LM317A pressure range on device body

Tateo,

We are working on this question. How does the device body become pressurized? Is it being used in some high/low altitude conditions? I am not aware of any pressure specs but I am also not aware of how the device becomes pressurized. Please provide more information if possible. Thank you!

Thank you for your reply.
They consider to glue device body to heatsink. So they need to push the device body by φ5mm pin.

Best Regards,
tateo

Tateo,

There is no spec for this. Use as much pressure as needed but if there is damage to the package case or the board or heat sink underneath then it is too much pressure. Maybe consider using a soft/wide tip to press the device to the heat sink to dissipate pressure if the device does becomes damaged.

Kind regards,

Michael