TPS 54060 : Package Question for Decapsulation

Mehmet Ogut

Other Parts Discussed in Thread: TPS54060

Does TPS54060DRC have dielectric glass layer over the metal at the top? In other words, is it suitable for decapsulation? Any suggestions about that.

Thanks,

over 8 years ago

0 JohnTucker over 8 years ago

TI__Guru**** 191445 points

Yes you can de-capsulate it. You can use acid, be careful not to apply too much. There is no glass layer on top of the metallization layers.

0 Mehmet Ogut over 8 years ago in reply to JohnTucker

Prodigy 20 points

Thank you John for your quick response. We tried to decapsulate TPS54060 with DGQ package type. It did damage to metal layer since no dielectric layer was present and the copper wires dissolved in the acid before the die is exposed. Is there any difference between DGQ package and DRC package of this IC regarding to the decapsulation process?

0 JohnTucker over 8 years ago in reply to Mehmet Ogut

TI__Guru**** 191445 points

You have to be careful and use a small amount of acid to slowly remove the package. Maybe I can find details about it. I am out of the office tomorrow. It may be a few days.

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TPS 54060 : Package Question for Decapsulation