Other Parts Discussed in Thread: TPS23753A
The datasheet says "EP Exposed metal pad on the underside of the device. It is recommended to connect this pad to a PC Board plane connected to the VEE pin to improve heat dissipation."
My application uses Class 1 power (2 watt) and other routing concerns make connection to VEE plane difficult.
Measuring the pad to VEE shows no internal connection. Is the only reason for heat dissipation and hence why it is only recommended and not required? If so then I suppose it would also be acceptable to connect the exposed pad to RTN plane for adequate heat dissipation and eased routing?
Please advise. Thanks.