Hi
My customer has questions.
Customer are evaluating using TPS546C23EVM.
In the EVM evaluation, no problem concerning the heat dissipation characteristics has occurred.
However, in the data sheet (P96) recommend that 21 Thermal Via be provided.(In addition, EVM has 35 Thermal Via.)
Also, from the customer's implementation rules, only 18(φ0.3) TPS546C23 Thermal Via can be provided.
Question.
Install 18 Thermal via ,and around Thermal PAD installed 17 vias,
Can you obtain the same heat dissipation characteristics as EVM?
Best Regard
T Kishi