Hello, I have to create footprint for LM5575 and I didn't found thermal pad dimensions. Original datasheet doesn't say anything really usefull and HTSSOP package drawings says "thermal pad dimension on separate sheed". But there is no separate sheet :) There could be a problem with soldering if there will be too much solder paste under package. On the other side, from thermal resistance POV there should be much paste as possible.
Thank you
R.
