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LP5521: solder bridging problems

Part Number: LP5521

We have built boards with this part since late 2015. In September of 2016 we started seeing a lot of solder bridges on them. We found that the parts were coming with a full load of solder on all the terminations. We still have to print a normal amount of solder paste on the board to get solder joints, but the total amount of solder is excessive and causes the bridging. We would like to know:

1. Why otherwise typical BTC components have solder added to the terminations?
2. Why is there no mention of this added solder in the data sheet for the part?
3. Is there an option for normal BTC's without the added solder?

  • Hi Blaine,

    I can help investigate with our Packaging Team.

    1) Please provide the full TI part number of the device.   The LP5521 has two package options, DSBGA and QFN, and we need to know which version you are buying.

    2) Are you buying the device directly through TI or via Distribution.  

    3) Can you send us images of the Top and Bottom sides of a suspected problematic unit (as received / before mounting).

    Andy Lutz

    Customer Quality Engineer

    Texas Instruments Incorporated

    Santa Clara, CA USA

    (669) 721-3539 (Desk)

    (408) 607-6551 (Mobile)

    andy.lutz@ti.com