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LP2951-50: LP2951-50 SON package thermal pad connection

Part Number: LP2951-50

Hello,

Can you clarify where the exposed thermal pad of the LP2951-50 (SON package version) should be connected to?  Throughout the datasheet, I couldn't find any information on this other than the pad must be soldered to a PCB. I assume that the thermal pad should be connected to ground, but  I need somebody from TI to confirm this. Thank you.