TLV1117IDRJR in the datasheet you give a thermal resistor from chip to ambiente for 38K/W. With this number a abient temperature I get a max Power of 2,8W. When I try to calculate with the calculation tool from TI I need a spread plane of at least 500mm² to get a power dissipation of 1W. Did I misunderstand anything? Best regards Eugen Mayer]
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