Hello guys,
I am relatively new to power management design with heat sinks. I use the TPS7A8300 with 6VDC IN and 4VDC OUT@ approx. 1A worst case.
At first I used the TI webench for thermal simulation without a fan and found that with thick copper I am pretty much on the safe side. The problem is, my design has some pretty small ICs so I can't use 105µm thick copper unless I create two PCBs which is not desired. So I resimulated with 35µm copper where the device will heat up too much without a heat sink. Since the TPS7A8300 has thermal pad design I wanted to ask if this will work, if I attach a glued heat sink on the device's top for propper thermal drain, or if this will not work, because the thermal pad is the only way to remove heat from the device.
best regards
Benjamin
