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TPS79850-Q1: Over-molding PCB - Heat shock to device

Jared Becker
Genius 11845 points

Part Number: TPS79850-Q1

Hi Team,

The TPS79850-Q1 is on a PCB that needs to be overmolded using low pressure (LP) PA 641 Technomelt.  The temp rise from ambient to several hundred degrees is less than 10 seconds.

The question is, will there be an impact to the internal structure of the device?  If so could you gauge the likely failure modes and if you offer any solutions.

I am not concerned with the solder re-flowing and/or part movement, only with the part itself and its internal workings.  The material injection temperature is 210 to 240°C (410 to 464°F). Thermal profile below..

The part will not be turned on during this process. I am aware of the storage temperature spec at 150C, but since this is only for 10 seconds, I am wondering what the effects will be.

Looking forward to your feedback.

Jared

  • 0
    TI__Guru 55940 points
    Hi Jared,

    Please note that the peak solder temperature for this device is 260C (found on the quality tab of the product folder). As such mentioned in the following application report, a Classification Reflow Profile allows for 30 seconds within 5C of the peak solder temperature. So long as your LDO is not turned on during this process, you should be ok.

    www.ti.com/.../snoa550e.pdf

    Very Respectfully,
    Ryan