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BQ51013B: Looking for PCB layout recommendation for the VQFN package version of the BQ51013BRHL device.

Part Number: BQ51013B

Looking for PCB layout recommendation for the VQFN package version of the BQ51013BRHL device.

  • BQ51013BRHL QFN package version of the device.
    Advantage to this package is improved thermal performance from the thermal pad. Key to this package is to connect the pad to larger ground plane to spread the heat.
    Example layout of this package is available in the product folder "Technical Documents" -- "Design Files"
    www.ti.com/lit/zip/sluc632