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LM5122: Separate Grounds necessary?

Part Number: LM5122

Hello

I have been laying out a PCB using the LM5122 and using the reference design in the datasheet as my design. It has PGND and SGND grounds and they meet at the exposed pad on the underside of the chip. However when I look at the LM5122EVM-1PH Wide Vin Synchronous Boost Controller Evaluation Module they only have one ground being SGND. The reference design seems to conflict with the evaluation module, so don't know really which way to choose. I suppose the evaluation module has the merit that it's a physical design so it should work good enough as it brought/sent out to engineers to probe and play around with.

I was just wondering if anyone else has just used one ground? If so, is it more noisy? Would you recommend it?

Regards

Jon

  • Hello
    Please have PGND and separated SGND/AGND grounds and let them meet at the exposed pad on the underside of the chip.
    Ground separation is good to minimize a noise injection from the PGND to AGND. Please follow the evaluation module layout.
    Thanks