TPS7A30: TPS7A30

DEBPRASAD DAS72

Prodigy 60 points

Part Number: TPS7A30

I have selected TPS7A30 part for my design.

What is the power dissipation rating of this particular device ??

Is it advisable to use for new design??

Thanks

DEB

over 8 years ago

0 JCHK over 8 years ago

TI__Guru 50090 points

HI DEB,

The TPS7A30 has a built in current limit and thermal shutdown to protect itself. To understand how close you might be to thermal shutdown I would need to know VIN, VOUT and your nominal (and Peak) load current. Depending on the package you are using, the below table can give you a guideline as to how close you are getting to thermal shutdown:

RThetaJA can help you to estimate the die junction temperature via equation 9 in the datasheet:

The PD*RThetaJA will give you the die's junction temperature above PCB ambient.

I hope this helps.

Regards,

0 DEBPRASAD DAS72 over 8 years ago in reply to JCHK

Prodigy 60 points

Hello John,

Thanks for quick response.
In my present design the specification are as follows :
VIN= -13V, Vout = -5V, Inominal = 20 mA and Ipp = 30 to 35 mA.
I have selected HVSSOP package.

Thanks ,

DEB

0 JCHK over 8 years ago in reply to DEBPRASAD DAS72

TI__Guru 50090 points

HI DEB,

With an 8V drop and a load current of 35mA, you will be dissipating 280mW of power in the LDO. With a good layout (i.e. High-K board) Tja for the HVSSOP package is 47.7 so 8V x 0.035A x 47.7C/W = 13.4C rise above the PCB ambient.

I hope this answers your question

Regards,

0 DEBPRASAD DAS72 over 8 years ago in reply to JCHK

Prodigy 60 points

Thanks John for the assistant.

0 JCHK over 8 years ago in reply to DEBPRASAD DAS72

TI__Guru 50090 points

Glad I could help.

Thank you for using TI!

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TPS7A30: TPS7A30