Dear All,
We're using the LP8860BQVFPRQ1 material in our production, and have a question (because of the soldering process): what is the distance between the bottom surface of the lead and the bottom surface of the body. Based in on the IPC7351, we see that it can be max 0.05mm
We received the following information/answer from TI:
As per your IPC-7351 below, if the the distance in question is it „K“ the min= 0.05 (not max 0.05mm).
The answer was already provided earlier from the datasheet (http://www.ti.com/lit/ds/symlink/lp8860-q1.pdf) page 8 and it’s confirms that the distance in question is (min)0.05mm-(max)0.15/0.25mm :
Our latest feedback for the issue:
We are looking for the distance of the bottom surface of the lead and the bottom surface of the body (component thermal pad).
Ti wrote in the attached datasheet about the stencil thickness:
In case of the distance between the bottom surface of the lead and the bottom surface of the body is 0.25mm then how is it possible to solder the component with 0.127mm stencil thickness? There will be 0.123mm gap if we mount the component with maximum force and the bottom surface of the lead touch the PCB pad!
Based on the information above, how can we solder the material properly? What setup, stencil etc.. can we use?
Thank you in advance,
Arpad Szi
