Other Parts Discussed in Thread: CSD17577Q3A
Hello,
i'm actually designing a power supply circuit using a boost converter IC from TI. One of the MOSFETs i'm using it's the one listed above.The data sheet has a recommended PCB layout, but i would like to know if i could add some thermal vias on the drain pad of the MOSFET in order to improve heat dissipation and to avoid using an extra heatsink? I was thinking doing a layout similar as the one recommended for the CSD17577Q3A version. Thanks in advance!
Regards,
Emmanuel
