Hi,
For TPS650944, can you double confirm if PROCHO is high-active or low-active?
Regarding the VIA implementation for power pad, what is the minimum requirement we have here?
Thanks!
Antony
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Hi,
For TPS650944, can you double confirm if PROCHO is high-active or low-active?
Regarding the VIA implementation for power pad, what is the minimum requirement we have here?
Thanks!
Antony
Hey Antony,
Thank you for posting to E2E.
PROCHOT signal is active high (pulled high when PMIC temp > THOT). Processor wants PROCHOT_B (active low), hence the inverter.
The datasheet recommends 0.2 mm (8 mil) hole size. This matches what we use on the EVM. There is no specification for minimum or maximum, this is just the recommendation. The intention is to ensure good connection from PMIC power pad to ground.
Hi Kevin,
THanks for the reply. Do we specify the minimum number of GND VIA required for power pad?
Thanks!
Antony