VIA in land pattern

Aitor Sierra

Hi:

I noticed that in datasheet (Land Pattern Example) in Pin 11 there is a VIA in the middle of the pad. Why this through-hole VIA ?

thanks

over 8 years ago

0 LeonardEllis over 8 years ago

TI__Guru 71526 points

Aitor,

Please specify what device/datasheet you are referring to. Land pattern Example doesn't tell me what datasheet you are referencing. And just from experience, usually if there is a pad under a device, it is a thermal/GND pad and connected to GND/0v plane. Please check this on the device you are asking about.

~Leonard

0 Aitor Sierra over 8 years ago in reply to LeonardEllis

Prodigy 60 points

Sorry. It is TPS61089x at the end of the datasheet

0 Helen chen over 8 years ago in reply to Aitor Sierra

TI__Mastermind 40080 points

This via can help the heat dissipation. You can also choose to not place this via when create the component lib.

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VIA in land pattern