Other Parts Discussed in Thread: TPS74401
Hi,
Can you provide the recommended layout for TPS74401 DDPAK? The EVM is used only QFN and I checked similar LDOs but there is no information for DDPAK layout.
Best Regards,
Satoshi / Japan Disty
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Hi Satoshi-san,
I can not find an example of a recommend layout for the DDPAK so I will have to confirm with the US team later.
I imagine your customer is wanting this package for the slightly improved thermal performance over the QFN (RGW) package. If my assuming is correct, you customer will want to pay close attention to the JEDEC high-K standard we use to generate our thermal data:
Hopefully we can find a recommended layout this evening.
Regards,
HI Satoshi-san,
I double checked an we have never laid out a board or reference design using the DDPAK package. For any LDO layout it is good practice to place input and output components as close as possible to the LDO to minimize trace parasitic. As I mentioned above, a good copper pour is required to optimize thermal performance.
Regards,
John