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TPS774: TPS74401 / Layout for DDPAK

Part Number: TPS774
Other Parts Discussed in Thread: TPS74401

Hi,

Can you provide the recommended layout for TPS74401 DDPAK? The EVM is used only QFN and I checked similar LDOs but there is no information for DDPAK layout.

Best Regards,

Satoshi / Japan Disty

  • Hi Satoshi-san,

    I can not find an example of a recommend layout for the DDPAK so I will have to confirm with the US team later.

    I imagine your customer is wanting this package for the slightly improved thermal performance over the QFN (RGW) package. If my assuming is correct, you customer will want to pay close attention to the JEDEC high-K standard we use to generate our thermal data:

    Hopefully we can find a recommended layout this evening.

    Regards,

  • Hi John,

    Thank you for your quick response. Please ask US team and confirm if there is any reference information for DDPAK.

    Best Regards,
    Satoshi
  • HI Satoshi-san,

    I double checked an we have never laid out a board or reference design using the DDPAK package. For any LDO layout it is good practice to place input and output components as close as possible to the LDO to minimize trace parasitic. As I mentioned above, a good copper pour is required to optimize thermal performance.

    Regards,

    John

  • Hi John,

    I tried to draw the layout for DDPAK briefly. Can you give your comment if I need to change for better electrical and thermal performance?

    Best Regards,

    Satoshi