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Thermal information of TPS54A20

Takahiro Nishizawa
Genius 5575 points
Other Parts Discussed in Thread: TPS54A20, STRIKE

I have questions about TPS54A20.

Question 1.

  This question is about thermal information θjc.

    - Does θjc(bot) mean GND?

    - Does θjc mean thermal resistance of center of the IC?

Question 2.

  Please tell me how to dissipate heat.

     - We think that heat stands out near SCAP pin.

       For example,

       Is it possible to strike a through hole / via to dissipate heat to a large area?

Best regards,

Takahiro Nishizawa

  • 0
    TI__Guru**** 191445 points
    Generally speaking the PGND pad is the reference for the thermal parameters and is the primary heat dissipating element. The other large pads also help to dissipate heat. It s assumed that the die temperature is more or less uniform across the entire area. For our test boards, we did not connect the SCAP pad to any additional large copper for heat dissipation purposes. i recommend you follow the layout guidelines in the data sheet.