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Dear Sir/Madam,
I want to check what is the baking condition for LM2585S-ADJ/NOPB with DDPAK/TO-263 (KTT) package
Based on AN-2029 Handling and Process Recommendations http://www.ti.com/lit/an/snoa550e/snoa550e.pdf Table 5, the table below only show <=4.5mm but the IC datasheet show this package height is >4.5mm. I show the forum mentioned the nominal thickness for TO-263 (KTT) is 4.445mm. Should I follow table 5 thinkness <=4.5 with MSL3 for the baking condition or you have another set of baking condition? Hope to hear from you soon.
Best regards,
Kpk
