BUF20800-Q1: Solder void percent vs That-JA(C/W)

Hello Dino,
We are investigating for the requested data and come back to you soon.
Best regards,
Brigitte

Hello Dino,

Could you please provide following details:
- customer board specification
- Is there one single void or multiple distributed voids in the solder?
- Where are the voids located?

Thanks and regards,
Diaara

Hello Diaara,

Please refer to the below comment
- customer board specification
=> please use reference board measured thermal resistance(30C/W) of datasheet.
- Is there one single void or multiple distributed voids in the solder?
=> one single void
- Where are the voids located?
=> Top of device( port 1 - port38)

Would you please share the available schedule of getting result?
If you need more information, please let me know.

Thank you.

Hello Dino,

Thans for your inputs.

For the modelling, the location of the void needs to be more specific. Is the void in the solder connecting the exposed thermal pad to the PCB?

I expect to get the results by Friday if all required inputs are received.

Best regards,

Diaara

Hello Diaara,

You are right. The void is in the solder connecting the exposed thermal pad to the PCB

Thank you.