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LM53635-Q1: How to disspate power without thermal pad?

Dongbao Zhou
Expert 4170 points
Part Number: LM53635-Q1

Hi Team,

Since LM53635-Q1 use Wettable Flanks package technology, it definitely improves the EMI performance. However, customer concerns about its thermal performance because it doesn't have a thermal pad, could you kindly explain this?

Thanks.

Best regards,

Dongbao

  • 0
    TI__Mastermind 23845 points
    Hi,

    Yes in order to relieve some thermal, you can put more vias near the GND pin for your design. Take a look at the EVM example for more info.
    Yes you are correct, we do not have a "dedicated" thermal pad for heat dissipation. But the trade off for that is we can reach higher efficiency with this package therefore it is a tradeoff.
    You could try to simulate your specific design inputs in webench and simulate the thermal depending on your power loss

    Thanks
    -Arief