• State
  • Locked Locked
  • Replies 1 reply
  • Subscribers 63 subscribers
  • Views 544 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

BQ24092: Stencil Requirement

Laura Shuey
Intellectual 810 points
Part Number: BQ24092

Can you please help us with a condition that we saw in a component with MPN: BQ24092DGQT.

 

It seem that the ground pad is higher than gully wing terminals, attached are 2 pictures were I can show you what I mean.

So the main request to you is, do you have any recommended design for stencil? I mean, a special configuration in stencil for solder paste printing.

 

I can't see any of this information in datasheet.

  • 0
    TI__Guru* 75976 points
    The BQ24092DGQT is a standard MSOP-PowerPAD package that is widely used. MSOP is Mini Small-Outline Package and PowerPAD is a TI configuration that will provide improved thermal performance.
    Additional information on this package, stencil and pcb recommendations can be found in a couple of application notes available on the TI Website.
    1.) PowerPAD Thermally Enhanced Package Application Note - SLMA002G
    2.) PowerPAD Made Easy Application Brief - SLMA004B
    3.) PowerPAD Layout Guidelines Application Report - SLOA120