Compare spec for thermal resistance

Satoshi

Guru 19645 points

Customer want to compare for thermal resistance on normal condition and unconnected power pad condition.

Is there reference data for thermal resistance without power pad?

Or, if there calculation method for these condition, please let me know.

Best regards,

Satoshi

over 7 years ago

0 Ed Walker over 7 years ago

Prodigy 5 points

Hello Satoshi-san,
Please provide a part number of the device in question.
Thermal resistance varies with device package, die size.

Devices with a power pad are not usually intended to be used without it soldered to the pcb.
That is why the data is not published.

0 Ed Walker over 7 years ago in reply to Ed Walker

Prodigy 5 points

Satoshi-san,
Here is a TI application note on Power Pad packages.
www.ti.com/.../slma002g.pdf

It provides a good review of the variables that affect thermal performance.

This may help your customer.

0 Ed Walker over 7 years ago in reply to Ed Walker

Prodigy 5 points

Good morning Satoshi-san,

I will close this thread now.

You will be able to reply for 60 Days if needed.

Please click the green button THIS RESOLVED MY ISSUE if you are satisfied with the responses.

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Compare spec for thermal resistance