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LMZ31710: Thermal dissipation

Jordi Ferre Ferran
Prodigy 50 points
Part Number: LMZ31710

Hi,


Im I designing an stand alone system WITHOUT any active cooling, so, thermal dissipation is a key paramenter. We are thinking in using dissipators attached to the main heating producers of the board.

For this project, I have selected DC-DC LMZ31710. So, my questions are related to this component.

Which is the best way to cool down this component ( without any active system ? )

- with a heatsink on top of the package

- with a heatsink attached to the bottom of the board, to GND PAD of LMZ31710 ?

- other ??


All information that you could give us about thermal dissipation of this component is welcomed.


Regards

Jordi

  • 0
    TI__Guru 50120 points

    Hi Jordi,

    The LMZ31710 has several PH pins(Phase switch node) that can be connected to one another for thermal relief. The recommended layout considerations in the datasheet provides common practices for optimizing thermal performance of the part with the need for active cooling. Power path traces should be wider than signal on the PCB layout. If needed adding a heatsink to the top of the package will also aid in thermal dissipation. 

    Regards,

    Jimmy 

  • 0
    TI__Mastermind 28020 points

    The best recommendation for drawing heat from the package is to add extra copper area on the PCB for the Vout, PH and PGND pads and layers.