Hi,
Im I designing an stand alone system WITHOUT any active cooling, so, thermal dissipation is a key paramenter. We are thinking in using dissipators attached to the main heating producers of the board.
For this project, I have selected DC-DC LMZ31710. So, my questions are related to this component.
Which is the best way to cool down this component ( without any active system ? )
- with a heatsink on top of the package
- with a heatsink attached to the bottom of the board, to GND PAD of LMZ31710 ?
- other ??
All information that you could give us about thermal dissipation of this component is welcomed.
Regards
Jordi