Dear Support,
I have multiple designs using the BQ25898D component. I have followed the BQ25898X layout guidelines documentation, but I am experiencing a fairly low yield after FAI board testing. At this point, I believe this is occurring as a result of thermal cycling, but I have not yet compared the X-rays from assembly and after FAI testing.
I was wondering if you wouldn't mind answering the following questions for me:
1) Are their PCB vendors TI recommends who are capable of fabricating the PCB techniques described in the BQ25898X layout guidelines documentation?
2) Would you be willing to share the name name of the PCB fabricator who currently makes the PCB board for the BQ25898D development kits?
3) Do you recommend any form of BGA under-fill with this component.
-Jared
