TPS7A8001: whether Pin 4 and thermal pad of TPS7A8001 are connected together inner IC?

Yang Qin2

Part Number: TPS7A8001

Dear linear regulator team,

could you please help to check whether TPS7A8001 Pin 4 and thermal pad of TPS7A8001 are connected together inner IC？

as described in datasheet, PIN 4 and thermal pad are both ground. but in customer's test, LDO output voltage is abnormal when only thermal pad of TPS7A8001 is connected to ground.

Thanks in advance.

best regards,

Yang

over 7 years ago

0 Eric.Preiss over 7 years ago

TI__Expert 4435 points

Hi Yang,

The thermal pad is most often NOT connected with a bond wire to the die ground. There may be an electrical path from the die ground to thermal pad, but it cannot be relied on as the ground pin for the LDO. We always recommend that the LDO ground pin be soldered to the board ground.

0 Eric.Preiss over 7 years ago in reply to Eric.Preiss

TI__Expert 4435 points

Hi Yang,

I reviewed the TPS7A8001 bond diagram. There is no bond wire from die ground to thermal pad.

0 Yang Qin2 over 7 years ago in reply to Eric.Preiss

TI__Prodigy 100 points

Hi Eric,

Thanks for your help very much.

Best regards,

Yang

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TPS7A8001: whether Pin 4 and thermal pad of TPS7A8001 are connected together inner IC?