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LM5007: Chip overheating

Part Number: LM5007

Issues with the part heating up and thermal cycling with a load of 200mA (IC REG BUCK ADJ 0.5A 8VSSOP)

Design: Vin=55VDC, Vout=3.3VDC Iout=200mA trying to get to 400-500mA
L=100uH
Ron=200K
Rcl=100K
Rfb2=3.3K
Rfb1=10K
Cout=22uF with series 1 ohm resistor.

any help appreciated

  • Since this package has no DAP, the ThetaJA will be large.  This means that it is difficult to get the heat out.

    I would try to increase the copper area for the ground and VIN pins to help as a heatsink.  I am not sure what

    ambient you need to work with, but anything that will reduce your ambient temperature will also help. 

    You may try to run at a lower frequency, to reduce the switching losses.  If you have an auxiliary supply to power VCC

    you could try that to help reduce losses.  You might also try swapping the device for another unit; the TSD on the unit you

    tried might be too low.

  • Product ambient could be 40C and possibly a 10C rise above that, although typical operation will be at room temp. What part does the evaluation board use and can this part realistically deliver 500mA or should I be looking at a different part?
  • The EVM is usually designed for 25C. 

    I would use Webench to find a device that meets your requirements.